CPU散热器导热粘接胶设计选型研究

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中图分类号：TN605 文献标志码：A文章编号：1001-5922（2026）1-0048-03

Abstract：To address the selection problem of thermally conductiveadhesives between CPU chips and heat sinks in electronic devices，three typical thermall conductiveadhesives were taken as the research objects.Their comprehensive performances were compared and verified through systematic experimental methods，and their physical and electricalpropertieswereevaluated，includingoperability，temperaturecyclereliability，shearstrength，actualheat dissipation temperature rise performance，and long-term aging stability.The results showed that the selected optimal adhesive model exhibited excellent performance in terms of thermal resistance，bonding strength，and environmental tolerance，which could efectively reduce the CPU operating temperature and improve system reliability. This study provides direct data support andoptimal schemes forthe selectionof thermallconductive adhesives inthe assembly of high-power CPU heat sinks，and also ofers referable experimental methods and theoretical references for the performance evaluation and selection of interface materials for similar electronic components.

KeyWords：electronic device;CPU chip;heat sink;thermal conductive adhesive

随着芯片技术迅速发展带来的功耗与热密度持续攀升，对导热粘接胶的综合性能要求也日益严苛[1]。（剩余3579字）