液态垫板钻孔应用研究

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Research on the Application ofDrilling with Liquid Deburr Film

WEIMeixiao LIU Yi LI Jingtao YIN Dawei ZHANG Lunqiang HUANG Yunzhong

（Shenzhen Newccess Industrial Co.，Ltd.）

Abstract：Withtherapiddevelopmentof theEthernet，bigdata，smart phones，andartificial inteligence，higher requirements are put forward for PCB. The high multi-layer PCB （board thickness i≥3.5mm ）may have PCB warping， poor surfaceflatness，height diferences，and other issues due to designand manufacturing processes.The rigid-flex board （R-FPCB）combines flexible circuit boardsand rigid circuit boards.In a combined structure，there must be differences in thickness，which lead toaheight diference in its surface structure.Both high multi-layerPCBs （witha thicknes AA≥3.5mm and rigid-flex boards （R-FPCBs） have burrs during mechanical driling，caused by surface warping，poor surface fatness and height diferences ofthe boards，which hasnot beensolved.This paperanalyzes thereasons for burrs dueto warping and height differences during mechanical drillingon PCB，and expoundson some common methodsand drawbacks for improving burrs inthe PCB industryat present.Itproposes an innovative technology that effectively improves mechanical driling burrsonPCBcausedbywarpingandheightdiferences，and introduces theresearch，applicationandevaluationof

the new technology in detail.

Keywords：highmulti-storey; thick plate;rigid-flex printedcircuitboard（R-FPCB）;bur;warping;height diference;base plate

0 引言

随着电子设备向高密度、高功率、小型化及柔性化方向迅猛发展，高多层厚板和刚挠结合板凭借其优异的电气性能、结构强度及三维互连能力，在高端通信设备、服务器、汽车电子、航空航天以及可穿戴设备等领域获得了广泛应用。（剩余3568字）