固体继电器采用铜丝键合的可行性与评价研究

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Research on the Feasibility and Evaluation of Copper Wire Bonding in Solid Relays

WANG Jue ZHANG Qiu (China Electronics Standardization Institute)

Abstract:With the increasing maturityofcopper wire bonding technology,more and more civilian semiconductordevices arebonded with copper wire.Someequipment manufacturers have to choose copper wire bonding devices,but copper wire bonding devices are prone toreliabilityisues due to materialsand processes.This paper analyzes the feasibilityof copper wirebonding forsolidrelays.Basedontheresearchonforeignevaluationstandards forcopper wirebondingquality,thepaper discusses the evaluation of copper wire bonding in solid relays.

Keywords:copperwire;bonding; feasibility;evaluation

0 引言

固体继电器从20世纪70年代发展至今，由最初简单的分立结构已经发展到采用混合集成结构的固体继电器，混合集成结构固体继电器结合了传统机械继电器和固体继电器的特点，具有小体积、高可靠性、长寿命、高灵敏度、低控制功率等特点。（剩余7222字）