晶圆级再布线过程控制质量评价方法研究

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Research on Quality Evaluation Methods for Process Control of Wafer-levelRedistribution

TANG Shuo1 Ql Xiao1 LIU Haowen1 CHEN Wenhao² SUN Xiaodong² （1.China Electronics Standardization Institute; 2.The 58th Research Institute of China Electronics Technology Group Corporation）

Abstract： As a new packaging technology， wafer level ReDistribution Layer （RDL） package technology has the advantages suchas shortening interconnection，reducing powerconsumption，andimproving integration.Itisthecore technologyofthe currentmicrosystemsandmulti-chipcomponents procesing，andcanbeusedtorealizetheintegrationofnewmultifunctional devices and microsystems.This paper studies the manufacturing process ofRDL，and analyzes the processmonitoring and qualityevaluationmethodsofRDLprocess，aswellas themaindefectsandtypcalfilure modesofRDLproces，inoderto layafoundation forthe enrichmentand perfectionof integrated circuits.

Keywords：redistribution layer;process control; reliability

0 引言

（WLP）的基础，是将芯片上的引脚通过薄膜工艺的再布线变换成阵列分布焊区或其他需要的分布图形的焊区，最终形成凸点或键合引脚的一种封圆级再布线（RDL）是实现晶圆级封装装技术。（剩余4130字）