陶瓷封装热管理技术发展与标准现状分析

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Analysis of the Development and Standards Status of Thermal Management Technology for Ceramic Packaging

PENG Bo FAN Shichao LI Lixia （The 13th Research Institute of China Electronics Technology Group Corporation）

Abstract：Therapiddevelopmentofchiptechnologyhasbroughtunprecedentedchallenges toits thermalmanagement. Electronic packaging heat disspation isoneof the key measures to solve the thermalmanagement problem of chips.This paper systematicalyanalyzes the developmentof thermal management technology forsingle-chippackaging and multi-chip packaging，andconducts statisticalanalysis ontherelevantstandards forpackagingthermalmanagementathomeand abroad. It is of great engineering guiding significance for understanding the developmentoftechnology and standardization.

Keywords： ceramic; packaging; thermal management; standards

0 引言

集成电路芯片演进的核心基石与标志是摩尔定律。（剩余4545字）