陶瓷封装BGA传输结构的信号完整性研究

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Study on Signal Integrity of BGA Transmission Structure of Ceramic Package

YAN Junhao SHAO Wenlong YU Ximeng YANG Zhentao DUAN Qiang LIU Linjie (The13th Research Institute ofChina Electronics Technology Group Corporation)

Abstract:According tothepackagingrequirementsofhigh-frequencyandhigh-speedintegratedcircuits,aBGAdifferential signal transmisionstructurebasedonlow-temperatureco-firedceramic (LCC)technologyisproposed,withanalation frequencyrangeofDC\~40GHz.Theoveralltransmision structure includes anuppersubstrate,alowersubstrate,andsolder ballsmade ofceramic materials.The overal transmission performanceof theBGA diferentialsignal transmissionstructure Wasanalyzed through simulationsoftware.This paper evaluates the performance of transmision structures fromtwo aspects: timedomainandfrequencydomain.Inthetime domain,thesignal integrityofthe transmisionstructure ischaracterized by thescattering parameters tested byavector network analyzerand the eye diagram displayedbyanoscilloscope.Itfocuses on analyzing the impact of transmision loss and crosstalk onthe signal eye diagram of thestructure.In the frequencydomain, the scatering parameters testedbyavectornetwork analyzer areused tocharacterizethequalityofthechanel tansmission signal,andthetestingandsimulationhavegoodconsistencywithintheconsiderationoferorrange.Theresultsoffrequency domaintestsshow thatfromDC to 40GHz ,the return loss of the differential transmission structure isbetter than 15dB,and the insertion lossis better than O.5 dB.

Keywords:BGA transmission structure; signal integrity; eye diagram; ceramic package

0 引言

随着5G信息技术的快速发展，高频、高速的数字电路频谱趋向于微波毫米波频率范围，可达几十 GHz 。（剩余6345字）