电子封装纳米材料及其性能研究进展

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Research Progress of the Electronic Packaging Nanomaterial and its Performance

ZHENG Xiaofan ZHANG Yaojun YANG Zhentao SHAO Wenlong (The 13th Research Institute of China Electronics Technology Group Corporation)

Abstract: Packaging technology is the basis ofcomponents,and the performance of materials is thekey factordetermining the technical indicators of packaging.Nanomaterials are playing more and more important role in the field of electronic packaging.The superior electrical, magnetic and optical properties of nanomaterials can enhance and improve the performanceofpackaging.This paper introduces the aplication statusof threenanomaterialsas theinterconnectmaterials andthermal interface materials,whicharethesilver nanoparticles,coppernanoparticlesandcarbon-nanotube-reinforced solders.Finally,itoulines theprospectsoflarge-scale applicationofnanomaterialsin the fieldofelectronic packaging. Keywords: electronic packaging; silver nanoparticles; copper nanoparticles; carbon nanotube

0 引言

封装是指承载半导体芯片、各种元件以及两者集成的模块、组件的包封体，其基本功能是提供电（光）信号互连、机械支撑、环境保护以及散热等。（剩余7888字）