小尺寸陶瓷封装用熔覆金锡合金焊料盖板可靠性验证

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Reliability Verification of Cladding Gold-tin Alloy Solder Cover for Small-sized Ceramic Packagee

WANG Mingyang PENG Bo WEI Yujin SONG Yunhe （The 13th Research Institute of China Electronics Technology Group Corporation

Abstract：Thepaperisbasedontheindependentlydevelopedcladdinggold-tinaloysoldercover，andanalyzesthereliability ofthecoverfromtheaspectsof theprocessing state，thegold totinratioofsolderforcladding，andtheoxidationdegreeof solderaftercladding.Thereliabilitytestsareconductedbysimulating theactualuse environmentofthe products.Meanwhile， it analyzes the microstructure of the cladding interface and the coating structure by scanning electron microscopy.

Keywords： cladding gold-tin alloy solder cover; reliability; microstructure

0 引言

微电子封装中陶瓷外壳因其高可靠性的优点被广泛应用在各特殊领域，其未来发展趋势呈现在单芯片高性能化封装和多芯片高集成化封装两方面，由此导致了封装外壳的逐步小型化。（剩余3496字）