基于陶瓷基微系统外壳的电磁兼容性仿真研究

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Research on Electromagnetic Compatibility Simulation of Ceramic-based Shells for Microsystems

MA JiajiSHAO Wenlong YU Ximeng YANG Zhentao DUAN QiangLIU Linjie （The 13th Research Institute of China Electronics Technology Group Corporation）

Abstract： System in Package （SiP）ceramic shels，whichcan integrate digital，analog circuit systems orsubsystems into one package.This paper uses electromagnetic simulation software to construct a thre-dimensional model and analyze electromagneticproblemssuchasouplingsoace，adiation，androtalkbetweendigitalandaalogsgnalsinaic shels.Tesimulationresultsprovideastrongbasisforcomprehensiveanalysisofelectromagneticproblemsandcaneffciently optimize thestructural designofSiPceramic sels.Itisfound thatbychanging thepower ground distribution，cavitylayout， andotherpackagingstructuresofdigitalandanalogcircuits，ElectromagneticCompatibility（EMC）issuescanbeavoided，wich includestrongcoupling，resonance，andcrosstalk.Basedontheresultsofthisresearch，theefciencyofsubsequentnewproduct design can be significantly enhanced，and the production cycle and quality of products can be improved.

Keywords： digital microwave integration; electromagneticcompatibility; microsystems; ceramic package shells

0 引言

发展，半导体产业的工艺和系统的集成性也发展的越来越快。（剩余3422字）