宇航元器件封装材料进展及发展趋势

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Progress and Development Trend of Packaging Materials for Aerospace Devices and Components

MA Jiaji ZHANG Yaojun QIAO Zhizhuang SHAO Wenlong (The 13th Research Institute of China Electronics Technology Group Corporation)

Abstract:Aerospace devicesandcomponentsare thefoundationofaerospace projects.Packaging technologyis the basis of devicesand components.Astronautical devices requireoptimization of various performance indicators such as light weight andhigh strengthTherefore,thepackagingmaterialsshouldhaveexcelentmechanical,electricalandtermalproperties. This paper introduces thestructureoftypical packagesandthe progress inresearch anddevelopmentofceramicmaterials, conductormaterials,metalmaterialsandheatdisipate materials.Itfurtherpredictsthedevelopingtrendofpackagematerials based on relevant materialsat home and abroad.

Keywords: aerospace; packaging; material; developing trend

0 引言

宇航用高可靠电子元器件作为我国航天工程的重要基石，可以体现国家科技进步，彰显国家综合科技实力。（剩余6808字）