国产化CCGA封装FPGA 器件的力学加固工艺研究

打开文本图片集

中图分类号： TQ433.4+37 文献标志码：A文章编号：1001-5922（2025）09-0001-04

Research on the mechanical reinforcement process of domestic-made FPGA devices with CCGA packaging

CHENHaifeng，WANG Tongyang，LI Yu，LU Miao （The 58th Research Institute of China Electronics Technology Group Corporation，Wuxi 214072，Jiangsu China）

Abstract：Taking a certain type of localized CCGA packaging FPGA deviceas the research object，the efects of different types of epoxy adhesiveand diffrent dispensing heights on the mechanical properties of CCGA devices were studied by finiteelement analysis.The simulationresults showed thatthe four-cornerepoxyadhesive could effectively increase the first-order natural frequencyof the device in the vibration environment，thereby reducing the probability of resonance fatigue failure of the PCBA，andalso greatly reducing the stressof the device and the solder column.The simulation of diferent dispensing schemes showed that EC2216 epoxy adhesive exhibited the best mechanical reinforcement performance when the dispensing height was 2 mm higher than that of the ceramic tube shell.Through the process implementationand board-level reliabilityverification，the simulation results were further demonstrated，and finallthe mechanical reinforcement method of such devices was obtained，which providesa guarantee for the board-level reliability of subsequent products.

Key Words ：localization ;epoxy glue ;dispensing solutions ;finite element analysis ;mechanical reinforcement

随着我国航天、航空、军工等高可靠性电子装备的快速发展，国产化高性能FPGA器件的应用需求日益增长。（剩余5070字）