汽车电子产品集成电路的失效分析

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中图分类号：U463.6 文献标识码：A 文章编号：1003-8639（2025）06-0165-03

FailureAnalysisofIntegrated Circuitsin Automotive ElectronicProducts

Li Zhibin

（Shanghai Huabi Testing Technology Co.，Ltd.，Shanghai 215ooO，China）

【Abstract】This paper focuses on the failure problem of integrated circuits inautomotive electronic products. Takingacertain profesional technicalserviceplatform project asanexample，itcomprehensivelyuses methods such as appearance inspection，functional inspection，non-destructive testing，and destructive testing to testthesamplechipof theinfrared detection module.The failure modes identified were solderball voids，solderbonding atthefet，warping， etc.The failure mechanisms were related tothe weldingquality，internal stress，circuit bridging，etc.Through thermal stresssimulationverification，itwasfoundthatthestabilityoftheassemblyandwelding processafectsthe welding quality，and a high parameterdrift rate willincrease the product defect rate.To this end，improvement measures such as strengthening processcontrolandadding high-temperaturebakingprocessesare proposed toefectively eliminate therisk of product failure and increase the domestic production rate of chips and project benefits.

【KeyWords】integrated circuit；failure；non-destructive testing；simulation verification

0 引言

伴随汽车电器元器件技术高速发展，其运行可靠性成为车企关注重点。（剩余3415字）