音响模块低温下无自听回环音分析与解决措施

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中图分类号：TN79 文献标识码：A 文章编号：2096-4706（2025）15-0006-04

Audio Module Low-temperature Analysis and Solutions for the Absence of Self-hearing Feedback Sound

WU Wei （The 10th Institute of CETC， Chengdu 610036， China）

Abstract： To address the fault of the absence of self-hearing feedback sound in audio modules at low temperatures，a detailednalysisofthe module'sself-hearing fedbacksound implementationprincipleisconducted.Theanalysisreveals that thefailure toproduceself-hearing feedbacksoundatlowtemperatures isdue toanimproper systemapplicationmatch.Itis confirmedthrough targetanalysisthatthedevice'spin13（VCC）andpin14（VCC）arenot intermallyshorted.Instead，there exists a resistance of approximately 700Ω between them. If only pin 14 is supplied with power， the voltage on pin 13 （VCC） will e pulleddown，andthevolagedvisionofthenon-logicircuitstructureinthechipwilleadtothedecreaseofthe orking voltageof the internallogiccircuit and insuicient powersupply.Astheexternal temperature decreases，thepowersupply shortageworsens untilitreachesacriticalstate，resulting inthefailureofthedevicefunction.Subsequentlythepin13ndpin 14 ofthe targetchipofthe module areshortedanddiscoectedrespectively，andthetestsarecarriedoutuderlow-tepeature conditions.Finallitisdeterminedthatthepin13andpin14ofthechiparenotshortedistecauseofthefaultoftheabsenceof self-hearing feedback sound.

Keywords：audio module; feedback sound; improper match; Kelvin connection; parameter drift

0 引言

音响模块是一个数字音频信号处理硬件平台，完成通导控制盒内部音频通道控制、语音处理、音频告警产生、语音编解码等功能。（剩余5769字）