电子灌封胶研究进展

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关键词：电子灌封胶；环氧树脂灌封胶；聚氨酯灌封胶；有机硅灌封胶；综合性能

中图分类号：TQ433.4'37  文献标志码：A 文章编号：1001-59（05）05-0017-04

Abstract：With thedevelopment of power electronic components to high-power miniaturization，electronic devices putforward higher performance requirements for electronic poting compounds.Epoxy resin potting compound，polyurethane poting compound and silicone poting compound have good thermal conductivity，excelent insulation，low thermal expansion coeffcient，low viscosity，strong flame retardant ability，andhave reliablecomprehensive properties such as strength，hardness，toughness，temperatureand weather resistance，etc.，which have atracted the attentionof he electronics industryand have been widely used in the fieldof electronic components.The development of high-performance electronic potting adhesives with“excelent thermal conductivity，high strength，good toughness and strong comprehensive performance”has become the focus and hot spot of current research.This paper reviews theresearch progress of electronic poting compounds，introduces the types of electronic poting compounds，andelaborates the performance control methods and applications of electronic potting compounds，and puts forward insights on the future research and development direction of electronic potting compounds.

Key words： electronic encapsulants ； epoxy resin encapsulants； polyurethane encapsulants； silicone encapsulants； overall properties

高功率、小型化是当今电力电子元件的发展趋势，这就对配套使用的电子灌封胶提出了更加苛刻的要求[1]。（剩余6924字）