手机摄像头封装中高温共烧陶瓷基板清洗工艺研究

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中图分类号：TN305.94；TN386.5 文献标识码：A文章编号：2096-4706（2025）23-0001-07

Research on Precision Cleaning Process and Surface Cleanliness Control of High Temperature Co-fired Ceramic Substrate in Mobile Phone Camera Module Packaging

CHEN Tianhu，KONG Xiangfeng，XIONG Yanjie （Dongguan Gaowei Optical Electronics Co.，Ltd. Dongguan China）

Abstract： With the continuous development of smartphone camera module packaging technology， High Temperature Cofired Ceramic （HTCC）substrates，asaltematives totraditional PCBs，havebecomeoneof thekeycomponents in mobile phone camera modules.Ensuring thecleanliness ofHTCC substrates during the packaging processignificantlyimpacts the packaging qualityandoverallreliabilityofthe modules.This studysystematically investigates theoptimizationof water-basedcleaning proceses toaddresreliabilityriskssuchaselectromigrationandtinwhisker growthcausedbypost-solderingresidueslikeosin andparticulatecontaminantsonHTCCsubstrates.ThroughafullfactorialDesignofExperiments （DOE），theeffectsofcleaning solutionconcentration，temperature，andconveyorspeedoncleaningqualifcationratesareexamined.Theresultsindicatethat cleaning solution concentration and temperature are decisive parameters. When the concentration is no less than 5% and the temperature no less than 45∘C ，the cleaning qualification rate reaches 100% ，while the conveyor speed shows no significant impact within theexperimentalrange.Theoptimized water-basedspraycleaning processefectivelyreduces ionicresidue onthe substrate tobelowthesafetythreshold，significantlyimproving productyieldand providingafeasible processolutionforhighreliabilitycameramodulepackaging.Futureworkcouldfurther integratequantitativeanalysisandintellgentcontroltoachieve continuous optimization of the process.

Keywords： HTCC; cleaning process; camera module packaging; water-based cleaning

0 引言

智能手机摄像头模组中，氧化铝微晶带经高温共烧形成的HTCC陶瓷基板是摄像模组的重要元件，手机摄像头模组封装后的HTCC陶瓷基板表面清洁度会直接影响摄像头模组的工作性能、可靠性及产品寿命（例如2024年三星S25曝光的雪花噪点问题）。（剩余8642字）