基于半刚性气囊的反应烧结碳化硅精密抛光特性

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中图分类号：TG580.62 文献标志码：A

Precision Polishing Characteristics of Reaction-bonded Silicon Carbide Based on Semi-rigid Bonnet

CUI Qing-qing1，FU Jian-ji²，WU Wei³，KE Xiao-long' （1. School of Mechanical and Automotive Engineering，Xiamen University of Technology， Xiamen 36l024，China; 2. Sabin Dong Institute of Micromaterials and Nanotechnology， Xiamen University，Xiamen 36llO2，China；3. State Key Laboratory of Ultra-precision Machining Technology，Hong Kong Polytechnic University，Hong Kong 999077，China）

Abstract：The experiment was conducted to analysis the performance of a semi-rigid bonnet in the precision polishing of reaction-bonded silicon carbide，aiming to investigate its material removal characteristics and surface quality improvement effects. The 3D morphology of the polished surface was obtained using a white light interferometer，and the spherical characteristics were verified through 2D cross-sectional profiles to evaluate the high-precision polishing outcome. The results show that the amount of material removed increases progressively with longer dwell time and higher spindle speed. After polishing with the semi-rigid bonnet，the surface roughness of the workpiece decreased from 251.69 nm to 8.72nm ，with a reduction of 96.54% ，which significantly improved surface uniformity and reduced microscopic defects.

Keywords： material removal; bonnet polishing；precision polishing；semi-rigid bonnet

精密抛光是一种高效的加工方式，用于提升材料表面质量，尤其在高硬度材料和精密器件的制造中。（剩余7839字）