3ω方法在芯粒热阻测试中的应用研究

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中图分类号：TB9；TK123 文献标志码：A 文章编号：1674-5124（2025）11-0166-07

Abstract： As an important parameter characterizing the heat dissipation performance of semiconductor power devices，the thermal resistance of chiplets currently lacks effective measurement methods.To address the need forchiplet thermal resistance testing，a new measurement principle and scheme is proposed based on the traditional 3ω thermal conductivity measurement principle. By building a test system and preparing samples suitable for the 3o method，comparative tests were conducted on three typical chiplet structures，and the variation ofchiplet thermal resistance with temperature was further studied.The test data show thatthis method can measure the thermal resistance parameters of chiplet samples，and the data are in good agreement with device structures and temperature conditions.This method has practical value for testing chiplet thermal resistance parameters and can provide references for evaluating chiplet heat disipation performance and thermal design work.

Keywords： thermology; thermal resistance ofchiplet; 3o method; thermal design; thermal conductivity

0 引言

随着半导体器件向着小型化、高集成度、高功率水平的不断发展，器件散热性能成为设计和应用过程中越来越重要的考虑因素川]。（剩余8382字）