基于有限元仿真的服务器CPU芯片翘曲分析

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中图分类号：TN601；TP391.99 文献标志码：B

Analysis of server CPU chip based on finite element simulation

SHANGGUAN Xiaorui， WU Jihui， YANG Longjiang （Shanghai Aerospace ScienceandTechnologyElectricApplianceResearch InstituteCo.，Ltd.，Shanghai2OO331，China）

Abstract：To ensure the thermal reliability of server CPU chips，the variation law of chip warpage with environmental temperature is obtained by finite element simulation.The simulation results of chip warpage are compared with theoretical and measured values，and the warpage mechanism and influencing factors of server chips in service is analyzed.DOE analysis is used to identify sensitive factors that affect chip warpage. The results show that the difference between simulation and testing of chip warpage during the 100C insulation stage is only 0. 004mm ，indicating high accuracy；the influence of material parameters of chip various components on chip warping is much greater than the influence of changes in the geometric dimensions of each component.

Key words： CPU； thermal load; warping;DOE

0引言

CPU芯片是服务器的核心部件，承担着数据处理与指令执行的关键职能，是现代信息系统的“神经中枢”。（剩余5924字）