微电子封装领域中纳米银的研究进展

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关键词：纳米银；微电子封装；综述；芯片互连；微电子键合

中图分类号：TN604

文献标识码：A

DOI：10.14106/j.cnki.1001-2028.2025.1542

引用格式：黄江潇， 张新孟， 王秀峰. 微电子封装领域中纳米银的研究进展 [J]. 电子元件与材料， 2025， 44（3）： 347-362.

Reference format： HUANG Jiangxiao， ZHANG Xinmeng， WANG Xiufeng. Research progress of nano silver in the field of microelectronic packaging [J]. Electronic Components and Materials， 2025， 44（3）： 347-362.

Research progress of nano silver in the field of microelectronic packaging

HUANG Jiangxiao， ZHANG Xinmeng，WANG Xiufeng

（1. Key Laboratory of Green Preparation and Functionalization for Inorganic Materials， School of Materials Science and

Engineering， Shaanxi University of Science and Technology， Xian 710021， China; 2. Xijing University Intelligent

Equipment Research and Development Center， Xian 710123， China）

Abstract： Nano silver possesses outstanding properties such as excellent interfacial conductivity， high surface area， superior transparency， and efficient thermal conductivity. These characteristics make it highly beneficial for the performance enhancement of the next-generation microelectronic packaging， particularly in wire bonding and electrical contacts. In this paper， the structural and functional advantages of nano silver are explored， the advancements in synthesis technologies and their compatibility with various application scenarios are systematically reviewed. The mechanisms of particle size control in both physical and chemical synthesis methods and the adaptability to different processes are elaborated. Additionally， recent developments in nanosilver-based pastes， wires， and films are summarized， particularly in high-power devices， sensors， and flexible electronics. The key failure mechanisms， including resistance anomalies caused by electrochemical migration， damage induced by thermal cycling， and dielectric breakdown driven by electrostatic accumulation， are analyzed. And the corresponding mitigation strategies are proposed to address these challenges. Finally， the future of the nano silver in revolutionizing microelectronic packaging technologies is prospected.

Keywords：  nanosilver; microelectronics packaging; overview; chip interconnection; microelectronic bonding

微电子封装技术实现了芯片的机械支持、环境保护、电信号引出端和散热通道等重要功能 [1]。（剩余26625字）