回流峰值温度对Sn-40Bi-1Ag-0.5Cu无铅焊膏性能的影响

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关键词：焊膏；坍塌性；回流曲线；峰值温度；剪切强度；微观组织

中图分类号：TG454

文献标识码：A

DOI：10.14106/j.cnki.1001-2028.2025.1485

引用格式：郑越， 徐冬霞， 徐深深， 等. 回流峰值温度对Sn-40Bi-1Ag-0.5Cu无铅焊膏性能的影响 [J]. 电子元件与材料， 2025， 44（3）： 338-346.

Reference format： ZHENG Yue， XU Dongxia， XU Shenshen， et al. Effect of peak reflux temperature on the properties of Sn-40Bi-1Ag-0.5Cu solder paste [J]. Electronic Components and Materials， 2025， 44（3）： 338-346.

Effect of peak reflux temperature on the properties of

Sn-40Bi-1Ag-0.5Cu solder paste

ZHENG Yue 1，XU Dongxia 1， 2，XU Shenshen 1，WANG Wenbo 1，FAN Xiaojie 3，

ZHANG Hongxia 4

（1. School of Materials Science and Engineering， Henan Polytechnic University， Jiaozuo 454003， Henan Province，

China; 2. Jiaozuo Green Welding Engineering Technology Research Center， Jiaozuo 454003， Henan Province， China;

3. School of Mechanical Engineering， Guizhou Institute of Engineering and Applied Technology， Bijie 551700， Guizhou

Province， China; 4. Luoyang Landi Glass Machinery Co.， Ltd.， Luoyang 471000， Henan Province， China）

Abstract： To enhance the reliability of Sn-Bi solder joints in long-term service， Sn-40.0Bi-1.0Ag-0.5Cu low-temperature lead-free solder paste was selected. The effects of the reflow temperature on the collapse， microstructure， and mechanical properties of the solder joints were investigated. The results show that in the reflow soldering process， when the holding temperature range is 100-110 ℃ and the holding time is 110 seconds， the reflow peak temperature has a significant impact on the performance of the solder joint. As the peak reflow temperature increases， the spreading rate and shear strength of the solder joints initially increases and then decreases. At a reflow peak temperature of 195 ℃， the solder joint exhibited smooth morphology with a maximum spreading rate of 86.35%， a moderately dense intermetallic compound （IMC） layer， and a maximum shear strength of 32.26 MPa. Based on the comprehensive performance of the solder paste， the optimal reflow peak temperature for Sn-40.0Bi-1.0Ag-0.5Cu low-temperature lead-free solder paste is determined to be 195 ℃.

Keywords：  soldering paste; collapseability; reflux curve; peak temperature; shear strength; microstructure

近年来，电子信息技术发展迅速，电子产品不断向微型化、便携化、多功能化和低成本的方向发展 [1]。（剩余8158字）