苯并噁嗪改性含硅芳炔树脂体系的固化动力学研究

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Study on the curing kinetics of silicon-containing arylacety lene resin modified by benzoxazine

LIGeng*，LI Jinliang，YINYue，CHEN Yu，GAO Xiaoru，LI Jun （HarbinFRPInstitute Co.，Ltd.，Harbin ）

Abstract：Silicon-containingarylacetyleneresin （PSA）featureshighthermalresistane，excelentdielectricpropertiesand good ablationresistance.Inthispaper，phenylene acetylene benzoxazineresin （BOZ）was used tomodifyPSA toobtaina modified silicon-containing phenyleneacetylene resin system（mPSA）suitable for hot melt pre-impregnation process.The curing processwas monitored byFourier transform infraredspectroscopy（FT-IR），and complete curing was achievedat 250∘ （24 C.Thecuring curves of mPSAresinatdiferentheatingrates were testedbydynamicdiferentialscanning calorimetry （DSC）. The activation energy Ea was calculated to be 111.24 kJ/mol and 114.10 kJ/mol based on Kissnger method and Ozawa method，respectively.Theaverage pre-exponentialfactorAwas4.58x1O1o.Thecuring kineticscalculationindicatedthat thecuring kineticsofthemPSAresinsystemconformedtothenth-ordercuringreactionmodel，andthecuringreactionorder was approximately 0.79.

Keywords：silicon-containing arylacetylene resin;modified; DSC;curing kinetics

1引言

随着航天飞行器飞行速度越来越快，以高超音速飞行器为代表的先进航天技术对树脂基复合材料结构件的耐温性提出了更高要求。（剩余5097字）