有机酸对SAC305焊锡膏焊接性能的影响

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中图分类号：TG425.1 文献标志码：A DOI：10.13338/j.issn.1674-649x.2025.01.012

Effect of organic acids on welding performance of SAC3O5 solder paste

FU Chong，LI Zhenyang，LI Xu ， XIAO Dong，ZHOU Xiaowei （School of Materials Science and Engineering，Xi'an Polytechnic University，Xi'an 710o48，China）

Abstract In order to investigate the effect of single organic acids and organic acid compounds on the solder wettability of SAC3O5 solder paste，the decomposition temperature of eight organic acids was determined by the heat loss test，with the reflow soldering experiments，the solder wettability of the solder paste prepared by single organic acid was investigated by using the solder joint morphology and the spreading rate as indexes. Three organic acids were selected for compounding by the uniform formulation design，and the interfacial layer of solder joints was analyzed by SEM and EDS. The results show that single organic acid A acid， Bacid and salicylic acid solder joints were in full shape，basically and spreading rate is more than 82% . Three types of organic acid compounding solder joints were full of bright and no retraction， and the spreading rate further increased.when the mass ratio of A acid，B acid and salicylic acid was 43.6% ， 28.2% and 28.2% ，the spreading rate reached a maximum of 87.82% ，and it was the best compounding content.The analysis of the interfacial layer of solder joints showed that the compounding ratio of organic acids had a significant effect on the thickness and morphology of the intermetalic compound（IMC） layer，and the thickness of the IMC layer was at the minimum and 2.39μm at the maximum. The IMC layer was relatively flat ，continuous and homogeneous at the optimum compounding content.

Keywords SAC305 solder paste; organic acid;spreading ratio;solder joint morphology;intermetallic compound（IMC）

0引言

焊锡膏是表面组装技术的关键原材料，由焊锡钎料和助焊剂组成[1-3]。（剩余10133字）