耐高温环氧团状模塑料的热老化研究

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Study on thermal aging of high temperature resistant epoxy bulk molding compound

HAN Ling*，TAO Lei，WANG Mingxing，GAO Yihan，DENG Fengyang，HUANG Anmin （ ， ）

Abstract：Compresion molding composite was prepared byusing high temperature resistant epoxybulk molding Compound （EP-BMC），andthe efect of thermal aging on weight lossrateof high temperature resistant EP-BMC wasstudied. The results showed that the glass transmission temperature was 217 ΔC ，and insulating resistance was 1.7×1014Ω ，and the horizontal flammabilityreachedUL-94HB level.The weightlossincreased continuouslyas thermal aging time went by， while the weight lossrate reduced gradually.According to thecomparison betweenmodelcalculationand experimentaldata， the weight loss predicted by Power Function model is more close to the actual value.

Keywords：high temperature resistant; thermal aging;weight loss;regression analysis

1引言

树脂基复合材料具有高比强度、优异的绝缘性能和低能耗等优势，广泛应用于航空航天、轨道交通、汽车、电子电器以及新能源等领域[1-3]。（剩余3951字）