模压工艺对环氧树脂模塑料性能的影响

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Effect of molding process on properties of epoxy resin molding compound

GAO Yihan*，HAN Ling，WANG Mingxing，LU Ruilin，ZOU Lumin （Zhuzhou Times New Material Technology Co.，Ltd.， Zhuzhou 412000）

Abstract：A high-temperature resistant and mechanically superior bulk molding compound （BMC）was prepared using epoxyresin asthe matrix，short glassfibers asreinforcement，and calcium sulfate whiskers as the primary filer.The curing exothermiccurveoftheresinwasanalyzed viadiferential scanning calorimetry（DSC）toinvestigatetheinfluenceof temperatureand timeonthe curing rate of epoxyresin，therebydetermining theoptimal molding processparameters.Byoptimizing trial molding conditionsdense surface pores and exposed fibers inthe molded specimens were eliminated.This optimizationenhanced thesurface hardnessand glasstransition temperature，and significantly improved wearresistanceof the specimen.

Keywords：epoxy resin; viscosity;BMC molding; composite material

1引言

团状模塑料主要由热固性树脂、短切玻璃纤维、填料以及其他辅助材料等组成，其制品具有良好的机械性能、耐热性、电绝缘性、耐化学腐蚀性等优点，广泛应用于汽车、电气电子等领域[1]。（剩余3694字）