SCM协议下美国芯片产业补贴政策的国际合规性研究

[中图分类号]D996[文献标识码]A[文章编号]1671-8372（2025）02-0067-09

Study on the international compliance of US chip industrial subsidy policy under the AgreementonSubsidiesandCountervailingMeasures

YANGMeng-sha，LIUXing-yue （LawSchool，Tianjin University，Tianjin 30oo72，China）

Abstract：With the localization and regionalization transformation of global supply chains，major economies worldwidehaveprioritized thesecurityandautonomyofsupplychains toaddresstheriskofdisruptionsarising from the highinterdependenceof globalsupplychains.Asthechipindustryisatthecoreoftechnologicalcompetition，the U.S. enacted theCreatingHelpful Incentives toProduceSemiconductorsand ScienceActtoreshape theglobalchipsupply chainthrough governmentsubsidies fordomesticchip manufacturing.Theincentive measures forthechipindustryunder thisActfallwithinthedefinitionofsubsidies under the Agreementon SubsidiesandCountervailingMeasures.While thesemeasuresarediffcult toconstitute prohibitedsubsidies，theymeet theconstituentelements foractionablesubsidies andthus violate theobligations under theAgreementon Subsidiesand Countervailing Measures.Chinaand other WTO members affected bytheActshouldactivelyutilize the WTOdisputesettement mechanisms，improve the trade remedy legal systems，and safeguard the legitimate interests of the chip industries in accordance with law.

Keywords：Agreementon Subsidiesand CountervailingMeasures;CHIPSand ScienceAct;industrialsubsidies; international compliance

一、引言

芯片是数字技术、人工智能、清洁能源等高新技术产业发展必不可少的关键产品，芯片产业已成为中美技术竞争及各国供应链安全布局的核心领域。（剩余15184字）