活性添加剂分散调控对 镀铜线精细化的影响

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中图分类号：TQ153.14 文献标志码：A 文章编号： 1000-5013（2025）04-0379-07

Influence of Dispersion Control of Active Additives on Refinement of Copper Plated Wire

LE Qihe， JIANG Kaiyong

（Fujian Key Laboratory of Special Energy Manufacturing，Huaqiao University，Xiamen 36lO21，China）

Abstract：To address the issue of edge refinement of copper plated wires in flexible cathode electrochemical machining，the influence of additive particle size and dispersion on copper plating quality was studied. The grinding time of additive particles and the slurry stirring method were adjusted，and laser activation was combined with electroless copper plating processes to prepare conductive wires and their morphology was analyzed. The results demonstrated that grinding time significantly influenced the particle size，which stabilized at 1.445 （20 μm after 48 hours of grinding，with improved dispersibility and reduced agglomeration. After stirring for 5mi 二 nutes using a high-speed disperser，the particle area fraction in polyurethane decreased by 11.9% compared to traditional stirring.The refinement and uniformly dispersed additive particles improved the uniformityof laser activated catalytic centers.Under the optimal conditions （48 hours grinding and 5 minutes high-speed stirring），the copper plated wires exhibited sharp and wel-defined edges，uniform distribution，and aconsistent wire width of approximately 85.1μm

Keywords：electrochemical machining;；laser activation； electroless plating copper;refinement；particle dispersibility

柔性阴极电解加工（FC-ECM）作为一种融合激光诱导化学镀（LDS）的创新性微纳制造工艺，近年来在柔性电子器件、三维模塑互连器件（3D-MID）及高精度传感器等领域展现出广阔的应用前景[1-4]。（剩余8908字）