碳化硅超声振动螺旋磨孔砂轮磨损与 表面质量研究

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中图分类号：TG663 文献标志码：A文章编号：1006-0316（2025）09-0044-07

doi：10.3969/j.issn.1006-0316.2025.09.007

Investigation of Grinding Wheel Wear and Surface Quality in Ultrasonic Vibration-Assisted Helical Grinding of Silicon Carbide Ceramics

HUANG Jiehua， FAN Qingwen， HE Yupeng （School ofMechanical Engineering， Sichuan University， Chengdu 610o65， China）

Abstract ： Silicon carbide ceramics are widely used as structural components in extreme environments and precision manufacturing fields，with substantial demand for hole-making.However，due to the inherent high hardnessand britteness of silicon carbide ceramics，the hole-making process is facing the challenges including severe tool wear and poor surface quality.To address these isses，this study investigates ultrasonic vibration-assisted helical grinding for silicon carbide ceramic hole-making.Experimental studies on ultrasonic vibration-assisted helical grinding has revealed the wear mechanisms of grinding wheelsand the formation principles of blind hole bottom surfaces.The helical feed method alters the motion trajectory of high-speed abrasive grains at the outer periphery，effectively avoiding the excessve wear of central abrasives on the wheel bottom in conventional non-eccentric grinding.The introduction of ultrasonic vibration further redues overall wear of abrasives on the wheel bottom. Compared to conventional non-eccentric grinding，the ultrasonic vibration-assisted helical grinding process significantly enhances the hole surface quality，achieving a maximum reduction of 41.8% in blind hole bottom surface roughness.

Keywords ∵ siliconcarbide ceramics ；ultrasonic vibration；helical grinding;hole-making；abrasive wear

随着各领域科技的快速发展，各行业对材料性能的要求不断提升，碳化硅陶瓷凭借其独特的优异的高温稳定性、化学惰性和机械强度，已经成为极端环境和高精度制造领域的关键材料[1-5]。（剩余7040字）