基于改进RT-DETR的PCBA管脚焊点缺陷检测方法

打开文本图片集

关键 词：PCBA；焊点检测；RT-DETR；多尺度特征融合；上采样;RepViT 中图分类号：TP391.4文献标识码：Adoi：10.37188/CJLCD.2025-0143 CSTR：32172.14.CJLCD.2025-0143

PCBA pin solder defect detection method based on improvedRT-DETR

LI Jiang 1，2 ， LUO Weil*，CHEN Hao 1 ， DENG Fuqin³ （1.Fujian Institute of Research on the Structure ofMatter，Chinese Academy of Sciences， Fuzhou 350108，China; 2.University of Chinese Academy of Sciences，Beijing 1Ooo49，China; 3.Fujian Xingwang Yuanzhi Technology Co.Ltd.，Fuzhou 35OlO8，China）

Abstract：To address the chalenges of the slow detection speed and the low accuracy in pin solder defectdetection for printed circuit board assemblies（PCBA），due to small target sizes，dense distributions，and complex backgrounds，this paper proposes an improved RT-DETR-based detection method. First，to overcome the limited global perception capability of the RepC3 module in multi-scale semantic feature fusion，a local and global collborative enhancement module is introduced to enhance the model's global understanding of multi-scale features. Second，a frequency-aware upsampling module is designed to effectively mitigate feature center ofset issues caused by traditional interpolation-based upsampling and to improve the model's responsiveness to key regions. Finally，RepViT is adopted as the backbone network，which improves feature extraction capabilities while significantly reducing model complexity. The proposed method is evaluated on two datasets： a proprietary PCBA pin solder joint image dataset collcted and annotated by ourselves on industrial production line and the public PKU-Market-PCB dataset. On the PCBA dataset，compared with the original RT-DETR，the proposed method achieves a 31. 44% reduction in model parameters，a 29.21% reduction in computational cost，a 9.88% improvement in mAP50 ，and an inference speed increase to 84.74 FPS. On the PKU-Market-PCB dataset， it yields gains of 6.75% in mAP50 and 23.10% in inference speed.Overall，the proposed method significantly enhances detection accuracy and eficiency while maintaining a balance between computational cost and real-time performance，demonstrating strong potential for practical engineering applications and further research.

Key words： PCBA; solder joint detection; RT-DETR;multi-scale feature fusion;upsampling；RepViT

1引言

管脚焊点检测是印刷电路板组装件（PrintedCircuitBoardAssembly，PCBA）制程中的关键环节，其焊接质量直接关系到产品的性能稳定性。（剩余19847字）