喷射成型Si-AI封装材料制备及热稳定性研究

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中图分类号：TQ028.8 文献标志码：A

Abstract： To meet the demand for high-performance packaging materials， study the relationship between the microstructure of Si- Al alloy primary silicon and the physical properties of the material， and match reasonable material composition； Through research on spray forming bilet technology and bulk material consolidation densification technology， breakthroughs have been made in the preparation process technology of Si - Al electronic packaging materials and the densification technology of Si - Al alloy ingots; By comparing and analyzing the effects of different process parameters on the microstructure of ingots， the optimal hot isostatic pressing process （temperature 570∘C ，pressure 100MPa ，time 6h ）was obtained. A packaging heat sink material with a density of 2.5-2.8g⋅cm-3 ，thermal conductivity of 120-180W⋅m-1⋅k-1 ，thermal expansion coefficient of 1.0×10-5-1.8× 10-5K-1 ，and elastic modulus greater than 80GPa was developed to solve the bottleneck problem in the development of high-power radar power device packaging materials in China.

Key words： packaging material; material composition; spray forming; process parameters

0 引言

随着现代电子封装技术的发展，传统封装材料已不能满足现代先进电子技术的封装要求，芯片产生的热量会改变电子封装材料的温度分布规律，从而影响结构应力应变响应特性，导致电子封装材料的失效位置发生变化，材料寿命和可靠性降低。（剩余11743字）