光刻增粘工艺中多因素对氨含量影响的研究

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[摘 要]文章对增粘过程中多因素对氨含量的影响趋势和作用机制进行了分析，得出了多种不同因素与氨含量的对应关系，并通过试验得出了增粘过氨含量随影响因素的变化规律，为增粘过程的优化、光刻及显影过程的环境要求及缺陷控制提供了指导作用。

[关键词]六甲基二硅氮烷；增粘工艺；氨及氨的衍生物；光刻

[中图分类号]TN305 [文献标志码]A [文章编号]2095–6487（2024）12–0041–03

Research on the Influence of Multiple Factors on Ammonia Content in Photolithography Adhesive Enhancement Process

JIANG Beihong，WANG Haoran，WANG Haoran，QIN Weifan，XING Li

[Abstract]The article analyzes the influence trend and mechanism of multiple factors on ammonia content during the thickening process， and obtains the corresponding relationship between various factors and ammonia content. Through experiments， the variation law of ammonia content with influencing factors during thickening is obtained， providing guidance for the optimization of the thickening process， environmental requirements of photolithography and development processes， and defect control.

[Keywords]hexamethyldisilazane； thickening process； ammonia and its derivatives； photolithography

1 背景

随着半导体制造技术的发展，半导体器件的特征尺寸迈向了更小的工艺节点，光刻技术在该领域的重要性变得越来越重要。（剩余3110字）