车载塑封半桥功率模块设计与研究

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中图分类号：U463.61 文献标志码：A DOI：10.20104/j.cnki.1674-6546.20240398

Designand Research ofa Vehicle-MountedPlastic-Encapsulated HalfBridgePower Module

YaoHaocheng，Wei Yingying，Zhu Zhanshan，Li Min （Global R&D Center， China FAW Corporation Limited， Changchun 130013）

【Abstract]To enhance the performance and reliabilityof power modules，the paper addreses inherent electro-thermalmechanical multi-physicscoupling characteristics.Utilizing FiniteElementAnalysis （FEA），comprehensivemulti-physics simulationsareconductedemployingANSYSsoftware tols，including Q3DExtractor，Fuent，MaxwellandTwinBuilder.The simulationresultsdemonstratethatparasiticinductanceandthermalresistancesignificantlyimpacttheswitching characteristicsandthermal management performanceofthepower modules.Athorough system-levelevaluationis performed through thermal simulation，parasiticparameterextraction，and Double-Pulse Testing （DPT）simulations.Furthermore，the simulationaccuracyissignificantlyimprovedbyimplementinganiterativeverificationprocesswhereexperimental measurementsareusedtorecalibratethesimulation models.Thisrefined methodology providesavaluable reference for the subsequent optimization of power module design.

Key words： SiC Power Module，Multiphysics Coupled Simulation，Current Sharing Characteristics

【引用格式】咬皓程，魏颖颖，朱占山，等.车载塑封半桥功率模块设计与研究[J].汽车工程师，2025（7）：1-9.YAOHC，WEIYY，ZHUZS，etal.Design andResearch ofa Vehicle-MountedPlastic-Encapsulated Half-Bridge Power Module[J]. Automotive Engineer， 2025（7）： 1-9.

1前言

与传统硅（Si）材料相比，碳化硅（SiC）具有更高的击穿电压、更低的损耗和更高的热导率，这些特性使SiC功率模块在高电压、高开关频率、高功率密度需求的乘用车领域具有较好的应用前景。（剩余10754字）