深空环境下电子器件可靠性研究进展

打开文本图片集

中图分类号：TN609 文献标志码：A DOI：10.12305/j.issn.1001-506X.2025.04.15

Abstract： Deep space environments （cryogenic environment，high temperature and intense radiation，etc.） seriouslyafect theperformance and reliabilityof spaceborne electronics，which impact thesafe operation of deep space exploration spacecrafts. SiGe is mostly appropriate for low temperature and intense radiation application. SiC and GaN are great candidates for all the extreme environments. The reliability of packaging materials servicein extremely high temperature environments has become a huge challenge to the further development of the spaceborne semiconductor devices.This paper summarizes domestic and international researches on the reliabilityof Si，SOI， SiGe，GaN，and SiC devices and device packaging materials under the harsh environments.The service environments and usage recommendations of the above semiconductor devices and packaging materials are summarized.

Keywords：deep space exploration； extreme environment； electronic devices；reliability； electronic packaging

0引言

探月工程、载人登月、空间站、火星探测等深空探测活动在政治、经济和科技发展方面具有十分重要的战略意义。（剩余30356字）