叠层片式热敏电阻表面绝缘处理技术的研究进展

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关键词：叠层片式热敏电阻；表面处理；综述；绝缘；抑制爬镀

中图分类号：TN371

文献标识码：A

DOI：10.14106/j.cnki.1001-2028.2025.1211

引用格式：程飞鹏， 文昕， 向艳， 等. 叠层片式热敏电阻表面绝缘处理技术的研究进展 [J]. 电子元件与材料， 2025， 44（1）： 110-119.

Reference format： CHENG Feipeng， WEN Xin， XIANG Yan， et al. Research progress on surface insulation treatment technology of multilayer chip thermistor [J]. Electronic Components and Materials， 2025， 44（1）： 110-119.

Research progress on surface insulation treatment technology of

multilayer chip thermistor

CHENG Feipeng， WEN Xin， XIANG Yan， GU Lihuan

（Chengdu Hongming Electronics Co.， Ltd.， Chengdu 610000， China）

Abstract： The development of microelectronics technology and compactness of electronic products lead the development of thermistors towards miniaturization and high reliability， which imposes stringent requirements on the materials and packaging technologies. Surface insulation treatment is the critical process that affects the packaging size and reliability of the multilayer chip thermistors. However， traditional glass spraying technology is difficult to be adapted for fabricating small-sized components. This review surveys several commonly used surface insulation treatment techniques for multilayer chip thermistors to prevent crawling plating， reduce electrolyte erosion， and improve environmental resistance. A comprehensive review is presented for the widely used processes in the chip component industry， including spraying， printing， deposition， and dipping. The characteristics of each process are compared and analyzed from the aspects of production cost， efficiency， and environmental impact. From the analysis of the intrinsic properties of insulating materials， it provides the foundation for matching appropriate processes. Finally， the challenges are analyzed for the development of surface insulation processes of multilayer chip thermistors. Future development directions are discussed from the perspectives of efficiency and environmentally friendly impregnation processes， high-performance high-temperature resistant materials， and optimization of existing processes and technological innovations.

Keywords： multilayer chip thermistor; surface treatment; overview; insulation; inhibition of crawling plating

以Mn、Co、Ni等为主要成分的热敏电阻[1]、以ZnO为主体材料的压敏电阻[2]以及以Fe、Ni、Cu、Zn等为瓷体组成材料的铁氧体电感[3]具有低电阻率的特点。（剩余15032字）