复合材料夹芯铜网结构真空导入工艺研究

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Research on vacuum infusion process of composite sandwich copper mesh structure

AN Chao*，SONG Pengfei，LIU Yenan，WEI Long，HE Yi （Hebei Province Multi-Base Composite Materials Industry Technology Research Institute Co.，Ltd.，Hengshui O53100）

Abstract：Thisstudy focusedontheproblems ofuneven infiltrationandinterfacedelaminationinthe VARI（Vacuum AssistedResin Infusion）processof thecompositematerial sandwichcoppermesh structure.Itsystematicallyinvestigatedthe influenceofthecopper mesh structureandtheinjection positionontheresinflowbehaviorandthequalityof thefinal products.Bydesigning differentcopper mesh aperture sizes，copper mesh wirediameters，laying methods，and injection positions，theoptimizationpathsofresinpermeabilityandporositywereanalyzed.Theexperimentalresultsshowedthatdifrent lay-upsequences andresin feed inletpositions had no significant impactonthecomposite material products.Thecopper wirespecification hadagreater impactonthecomposite material products.Whenthewire diameter was O.315，theaverage porosity was the smallest，with a value of 1.46% ，and when the wire diameter was O.4Oo，the interface bonding strength wasthegreatest，withavalueof 24.4MPa.Overall assessment showsthat thecomposite material productswithcopper mesh specification of GF1W1.25/O.4OO in the second group have the best performance.

Keywords： vacuum introduction；core copper mesh；low porosity

1引言

随着航空航天领域、电子设备领域和新能源领域对产品轻量化、多功能等性能需求的增长，同时具备结构承载与导电功能的夹芯铜网复合材料成为当前研究热点。（剩余5005字）