温度作用下高精电子厂房开洞华夫板的力学性能分析

打开文本图片集

Abstract：In order to analyze the stress and crack response of the floor under temperature influence in perforated waffle plate without expansion joints，the ABAQUS finite element analysis software is used to simulate the perforated wafle plate，comparing with the engineering practice，the stress and deformation of this kind of floor under different sizes and temperature variations are obtained. The results show that under the daily temperature variation，thefloor in the core area does not exceed the calculation stress limit，and the maximum displacement and stress concentration mainly appear at the slab-column joints.With the increase of concrete strength，the overall stress has no obvious change under the same temperature difference，and the increment is less than 2% ，but the increase of floor thickness leads to the sudden change of stress and the change of deformation trend. Considering the block construction of the reinforced concrete floor with large span，the reasonable control of the temperature difference between plates within 15-30°C is beneficial to the uniform stress distribution in the floor after monolithic pouring.

Keywords：temperature efect; perforated waffle plate； finite element simulation; super-long concrete

光电产业已成为新一代信息技术的重要支撑，对推动数字经济、智能制造等战略性新兴产业的发展起到关键性作用。（剩余11079字）