车规级芯片封装界面可靠性研究进展

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中图分类号：U463.6；TN40 文献标志码：B DOI：10.19710/J.cnki.1003-8817.20240166

Research Progressof Automotive-Grade Chip Package Interfaces Reliability

Sheng Fanghui 1 ，Liang Pengjian²，Ma Baoguang²，Yang Jinglei³，Dai Enqi 4 ， Li Xingsen' （1.GuangdongUniversityofTechologyGuangzhou510o6;2.GuangzhouHKUSTFokYingTungResearchInstitute，Guangzhou 511455;3.HongKongUniversityofScienceandTechnology，Hong Kong;4.Guangzhou SinomachLubricationTechnologyCo.Ltd， Guangzhou 510700）

Abstract：Packaging reliability of control chips，which serve as the central components of Electronic Control Units （ECUs），directlyaffcts thesafetyperformanceofautomobiles.Thispapersystematicallyinvestigates the mechanism of delamination failure of twomainstream ECUarchitecturesnamely Microcontroller Unit （MCU）and System-on-Chip （SoC）based on composite load characteristics of mechanical vibrationand temperature shock under typicalconditions of automobile.Theresearch resultsindicate that under multi-load coupling，interface bonding strength attenuationand thermal mismatchingof materials causedbyperformance degradationof key positions likedie atach interface，wirebond interfaceandunderfillpacking layeraretheprimaryfactorsinducingdelamination failure. This paper compares the application of threefinite element analysis techniques—Virtual Crack Closure Technique （VCCT）， J⋅ -integral，and Cohesive Zone Model （CZM），which indicates that CZM hasinterface representational dominance under large deformation condition of nonlinear material，while J -integralisapplicableto smalldeformation fracturezoneof nonlinearmaterial，andVCCThasadvantagesincomputational eficiencyintheanalysisof linear elastic steady-state crack propagation.

Keywords：Interfacedelamination，Finiteelementanalysis，Automotive-gradechip，Reliability，Extenics

1前言

在汽车智能化发展趋势的推动下，电子电气架构正由分布式向集中化的转变1。（剩余20726字）