镍框架与环氧树脂之间的粘接力改善研究

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摘 要：利用模封机对不同镀层的框架材料和环氧树脂进行注塑，然后利用粘接力测试仪对框架和环氧树脂之前的粘接力进行了分析，发现镍、金和镍钯银金的镀层材料中，镍镀层的粘接力最小，通过改性的方式可以增大镍层与环氧树脂之间的粘接力，将改性后的镍框架组装成产品后，发现可靠性前后产品的分层失效问题可以得到解决。

关键词：粘接力;环氧树脂;镍框架;改性

中图分类号：TQ323.5       文献标识码：A文章编号：1001-5922（2022）01-0051-05

Study of adhesion between frame and molding compound

LI Yu，HUANG Caiqing，LIU Tiande

（Shenzhen STS Microelectronics Co.，Ltd.，Shenzhen 518038，Guangdong China）

Abstract：In this paper，the frame materials and epoxy resin of different coatings were injection molded by the adhesion machine，then the adhesive force of the frame and epoxy resin were analyzed by the adhesive force tester.It was found that the bonding force of nickel coating was the least among the coating materials of nickel，gold and nickel，palladium，silver and gold，while the bonding force of nickel coating could be improved after surface treatment，and the layered of failure of the product before and after the reliability could be solved when assembling nickel frame into products.

Key words：adhesion force;frame;epoxy resin

芯片封装是电子元器件生产过程中的关键工序，可以保护电路芯片免受外界环境的影响。（剩余4717字）