面向强化装配界面接触热性能的导热特性异质化设计方法

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关键词：复杂机械产品；装配界面；接触热阻；导热特性；异质化；优化设计中图分类号：TH122文献标志码：ADOI：10.7652/xjtuxb202509007 文章编号：0253-987X（2025）09-0065-12

Heterogeneous Design Method of Thermal Conductivity for Enhancing the Thermal Contact Performance of Assembly Interfaces

WANG Chen 1，2 ，LIN Qiyin1，²，QIU Mingjun1，2，3，4，HONG Jun Ψ.1，2 （204号 （1.Key Laboratory of Education Ministry for Modern Design and Rotor-Bearing System，Xi'an Jiaotong University， Xi'an 710049，China；2. Schoolof Mechanical Engineering，Xi'an Jiaotong University，Xi'an 710049，China； 3. National Key Laboratory of Metal Forming Technology and Heavy Equipment，Xi'an 710o18，China; 4.China National Heavy Machinery Research Institute Co.，Ltd.，Xi'an 71oo18，China）

Abstract：To address the inadequate heat dissipation and operational performance caused by insufficient contact thermal performance at assembly interfaces， this study first establishes a numerical analysis model for contact thermal performance based on measured rough surface topography of assembly interfaces. Subsequently，contact thermal resistance under corresponding pressure and temperature conditions is tested to verify the accuracy of the numerical model. Finally， starting from the microscopic heat transfer mechanism at the assembly interface，a heterogeneous design approach for thermal conductivity is proposed， establishing a progressive iterative optimization design method for the thermal conductivity of assembly interfaces. The results demonstrate that the constructed numerical analysis model for contact thermal performance can achieve highprecision predictions，with a relative error of 15.52% . The heterogeneous design of thermal conductivity effectively reduces contact thermal resistance by improving the uniformity of temperature gradient distribution at the interface，resulting in a 23.12% improvement in contact thermal performance after optimization. This study provides new technical support for ensuring the contact thermal performance and overall heat dissipation in thermally sensitive complex mechanical products，such as electronic chip packaging and aerospace vehicles.

Keywords： complex mechanical products; assembly interface； thermal contact resistance; thermal conductivity; heterogeneous;optimal design

随着复杂机械产品向高集成化方向发展，由装配体内部热量聚集和热流密度急剧攀升引发的热性能不足问题[，已成为制约设备工作效能与运行稳定性的关键瓶颈。（剩余17409字）