固结与游离磨粒协同作用硬脆材料磨抛加工机理

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中图分类号：TG58DOI：10.3969/j.issn.1004-132X.2025.06.003 开放科学（资源服务）标识码（OSID）：

Grinding and Polishing Mechanism of Hard and Brittle Materials under Cooperation of Fixed and Free Abrasive Grains

LUO Chenyangl，² GUO Lei1，2 * CAO Chuqing² CAO Leilei²SHI Pengfei1，2

1.Key Laboratory of Road Construction and Technical Equipment（Ministry of Education）， Chang'an University，Xi'an，710064 2.Wuhu HIT Robot Technology Research Institute Co.，Ltd.，Wuhu，Anhui，241007

3.Guangxi Key Lab of Manufacturing System and Advanced Manufacturing Technology， Guilin，Guangxi，530003

Abstract： To investigate the material removal mechanism of hard and brittle materials during elastic grinding and polishing involving fixed and free abrasive grains，a diamond sandpaper grinding and polishing tool integrated with silicone rubber matrix was developed. The elastic tool was paired with varying concentrations of diamond polishing slurry. The contact stress and velocity distributions between the elastic tool and workpiece，as well as the abrasive grain-workpiece contact mechanics were analyzed to establish the material removal models for hard and britle materials. Subsequently， silicon carbide workpieces were used as test samples，with grinding and polishing pressure，tool speed，and abrasive concentration as processing parameters in single-point experiments，which were conducted to characterize the material removal profile on the machined surfaces. The experimental results reveal that the discrepancies between the established material removal models and the actual material removal depth range from 4.68% to 8.22% . The removal depth is positively correlated with grinding and polishing pressure，tool speed，and abrasive concentration. The established models may accurately predict material removal behaviors in elastic grinding and polishing processes.

Key words： hard and brittle material; material removal mechanism;elastic grinding and polishing tool；fixed abrasive grain;free abrasive grain

0 引言

石英玻璃、蓝宝石、碳化硅陶瓷等硬脆材料具有高硬度、高温稳定性、化学稳定性等优异的材料性能以及良好的透光、吸波性能，被广泛应用于光学元件、半导体芯片等高端精密装备[1-2]。（剩余16936字）