SiC衬底精密抛光分子动力学模拟研究进展

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AbstractObjectives: Si3N4 ceramic cylindrical rollers show excellent service performance in extreme working conditions,buttheirhardnessbritlenesothercharacteristicsleadtodificulties inmachining.Torealizehighquality highly flexible machining manufacturing Si3N4 ceramic cylindrical rollers,a diamond abrasive belt superfinishing machining method for Si3N4 ceramic cylindrical rollers is proposed.Methods:By buildingan ultra precision machining experimental platform with a diamondabrasive belt,designing orthogonal experiments,conducting horiZontal response analysis ANOVAon the experimental data, the influences abrasive particle size in the diamond abrasive belt,abrasive belt linear velocity,abrasive belt pressure guide roller speed on the surface roughness Ra the material removal rate RMRR Si3N4 ceramic cylindrical roller workpieces (ϕ 10mm× 12mm) are studied. Results:The effects abrasive grain size inthe diamond abrasive belt onboth surface roughness materialremoval rate the workpiece arethe most significant.The effects diamond abrasive belt pressre onthe surface roughess the workpiece are largercompared to thosediamondabrasive belt linear speed guiderolerrotational speed,while the effectsdiamond abrasive belt linear speed on materialremoval rateare larger compared to those diamond abrasive belt pressure guide roler rotational speed.The minimum value surface roughness the workpiece is (20号 0.0452μm when the grain size code the diamond belt is P3ooo,the linear speed the diamond belt is 10m/s ,the pressure the diamond belt is 94N , the rotational speed the guide roller is 300r/min ;the minimum surface roughness the workpiece is also 0.0452μm when the grain size code the diamond belt is P2ooo, the linear speed the diamond belt is 20m/s ,the pressure the diamond belt is 94N ,the rotational speed the guide roller is 200r/min When the rotational speed is 200r/min , the maximum material removal rate is 1.07531μm/min . Conclusions: The surface quality Si3N4 ceramic cylindrical rolers can be effectively improved by using the superfinishing method with a diamond abrasive belt.

Key words Si3N4 ceramic cylindrical roller; diamond abrasive belt; surface roughness; ultra-precision machining

摘要化学机械抛光(chemical mechanical polishing,CMP)是SiC衬底平坦化的关键技术,目前针对CMP工艺已有大量研究,但磨粒、溶液介质与SiC表面协同作用的机理并不明确。(剩余35333字)

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